RELIFE RL-044 IPZ18 CPU Universal Reballing Stencil is a precision BGA stencil designed for iPhone 18 Pro/18 Pro Max/iPhone Duo CPU chip reballing. It is compatible with IP18/Pro/Max/Duo and A20/A20 Pro models. Featuring real-device precise alignment, a thickness of only 0.12mm, ultra-thin high toughness, and accurate smooth apertures, it ensures complete and uniform solder points during reballing, improving repair success rates.
Features:
1. Real-device precise alignment, calibrated with factory drawings to ensure complete solder points.
2. Ultra-thin high toughness design at 0.12mm thickness, resistant to deformation and durable.
3. Accurate smooth apertures for uniform solder paste application and improved reballing quality.
4. Compatible with IP18/Pro/Max/Duo and A20/A20 Pro, offering strong versatility.
5. Made of high-quality materials with high precision, suitable for professional repair use.
Product Parameters:
Brand: RELIFE
Product Name: CPU Universal Reballing Stencil
Model: RL-044 IPZ18
Thickness: 0.12mm
Product Size: 80mm × 100mm
Package Size: 85mm × 105mm
Net Weight: Approx. 5g/piece
Compatible Models: IP18/Pro/Max/Duo-A20/A20 Pro
Type: Precision BGA Stencils
