Relife lead-free solder paste RL-403 RL-403S RL-404 RL-404S RL-405 RL-406 RL-406S R-F21 R-F22 BGA flux paste. Relife high-quality no-clean soldering tin flux paste for mobile phone motherboard BGA CPU circuit board SMD chip tin planting soldering repair.
Option:
1. Relife RL-403: 183℃ syringe solder paste 10cc.
2. Relife RL-403S: 183℃ medium temperature syringe paste 10cc.
3. Relife RL-404: 138℃ low temperature solder paste 50g.
4. Relife RL-404S: 138℃ low temperature syringe tin paste 10cc.
5. Relife RL-405: 138℃ low temperature solder paste 3ml.
6. Relife RL-406: 227℃ high temperature solder paste 40g.
7. Relife RL-406S: 227℃ high temperature syringe solder paste 10cc.
8. Relife R-F21: solder flux.
9. Relife R-F22: metal solder flux.
10. Relife X-soldering paste: Relife SP-X middle layer special solder paste low temperature 158 degree for iPhone X/XS/XS MAX.
Relife R-F22 Features:
1. Relife R-F22 multipurpose metal special flux, suitable for welding stainless steel, nickel sheets, copper, iron, galvanized sheets and other metals, repairing oxidation points, etc.
2. Easy to weld, easy to clean, no pungent smell, environmentally friendly solder mask rosin.
3. Quickly remove the oxide film on the welding surface, making it easier to weld and preventing oxidation.
4. Safe and non-conductive, high insulation resistance, no resistance, non-conductive, strong weldability.
Relife RL-403 Features:
1. 10cc 183℃ lead solder paste, Sn63/Pb37 alloy, 20-38um microns., the degree of melting point, easy welding, easy molding.
2. Strong viscosity. Good adhesion. Paste delicate particles small, only 20-38 microns.
3. Strong welding ability, high resistance, strong activity, bright and full tin. The storage time is long, and the storage time in the refrigerated environment is over 12 months, which is not easy to dry.
4. Application: Mobile phone chips repair, computer and digital service industries, high-precision circuit board SMT soldering, BGA welding process, etc solder paste lead solder at room temperature melting point 183℃, forming fast and easy to weld conductive.
Relife RL-403S features:
1. Syringe solder paste, no need to clean, easy to tin, no residue, 3 needles of different specifications + push rods are provided.
2. Suitable for sensors, wires, motors, fuses, connectors, metal casings, lighting, electronic components, SMT repairs, BGA chip tinning, etc.
3. Uniform dispensing, high purity, fine viscosity.
4. No false soldering, less residue, bright solder joints, strong tinning force, good conductivity, anti-oxidation, no corrosion to PCB.
Relife RL-404 features:
1. RL-404 138℃ lead-free low-temperature lead-free solder paste,
2. Tin lighting, climbing tin strong, high purity, temperature standard, easy to store.
3. Low melting point, high density, high resistance, strong activity, strong welding force.
4. Pure alloy composition, fine viscosity, tin plating does not bubble silver highlights good, environmental protection without any chemical pollution.
5. Meet the maintenance needs of motherboards for huawei and iPhone high-end machines.
Relife RL-404S features:
1. Relife RL-404S is the best lead-free solder paste to promote high-speed printing. It produces brick-like printing even with ultra-fine pitch stencils as small as 0.3mm.
2. Paste syringe, no-cleaning, easy-staining, no-residue, free 3 different specifications needles + spray gun.
3. Suitable for sensors, cables, motors, fuses, connectors, metal housings, lighting, electronic components, SMT repair, tinning BGA chips, etc.
4. Dispensing uniformity, high purity, fine viscosity, syringe design.
Relife RL-405 features:
1. Suitable for jump wire, CPU soldering, tail charger repair etc.
2. Fine paste, environmentally friendly lead-free.
3. Needle tube design, controllable usage, refuse to waste.
Relife RL-406 RL-406S features:
1. 227℃ high temperature lead-free tin paste suitable for iPhone motherboard middle layer tin planting.
2. Silver, lead free, high purity.
3. It is suitable for the masters who are pursuing the original repair effect. In order to avoid high temperature explosions of the tin, use the air gun carefully during the use process. It is recommended to use a heating platform to plant tin.
4. The storage time is long, and the storage time in the refrigerated environment is over 12 months, which is not easy to dry.
Relife R-F21 feature:
1. New emulsified advanced solder flux set, strong activity, high purity, halogen-free, environmentally friendly and lead-free.
2. Effectively reduce poor welding, reduce voids, reduce material surface tension, strong thermal stability, and provide excellent wettability.
3. Suitable for electronic components, SMT repair, BGA chip tin planting, circuit welding, tablet phone computer repair, home appliance repair, etc.
Skip to content