Special 45° Angled CPU & PCB Glue Removal Blade: RF4 RF-HD33, LB L05, RELIFE RL-023C Scraper Knife for mobile phone repair. Ultra-thin, Scratch-resistant degumming, high-temperature resistant, non-slip. Suitable for use around solder pads and densely packed components. Designed for stubborn adhesive residues, it penetrates deep beneath CPUs and ICs to remove stubborn black adhesive and aged residue.
Options:
1. RF4 RF-HD33: PI Underfill Removal Scraper, Handle 110mm + Blade 20mm
2. LB Tool L05: CPU Scratch-Resistant Degumming Knife, Model L05
3. RELIFE RL-023C: CPU/PCB Black Glue Removal Knife, Model RL-023C
4. MAANT PI-01: PI Degumming Knife Set, 157×10×10mm, 16g
5. MAANT PI-02: PI Degreasing Knife, 25×0.2×0.2mm, 0.1g
Features:
1. Made of imported PI material or flexible engineering plastic, soft and safe for IC surfaces.
2. Thin blade design easily inserts under chips to remove residual adhesive without damaging pads or traces.
3. High temperature resistance, stable under heat, no deformation.
4. Ergonomic anti-slip handle for precise control and reduced fatigue.
5. Suitable for CPU, IC, PCB, BGA, and hard drive glue removal.
M.Y Blade Product Parameters:
Single Blade Length: 27mm
Total Length (Handle+Blade): 163mm
Material: Imported PI
RF4 RF-HD33 Product Parameters:
Brand: RF4
Model: RF-HD33
Handle Length: 110mm
Blade Length: 20mm
LB Tool L05 Product Parameters:
Brand: LB Tool
Model: L05
Net Weight: 16.9g
Gross Weight: 42.4g
Product Size: 15×1cm
Package Size: 14×3.2cm
Material: Flexible engineering plastic tip
RELIFE RL-023C Product Parameters:
Brand: RELIFE
Model: RL-023C
Heat Resistance: 500°C
Handle: Steel, ergonomic
Blade: Soldering-iron tip style
MAANT PI-01 Product Parameters:
Brand: MAANT
Model: PI-01
Product Size: 157×10×10mm
Net Weight: 16g
Material: Imported PI
MAANT PI-02 Product Parameters:
Brand: MAANT
Model: PI-02
Product Size: 25×0.2×0.2mm
Net Weight: 0.1g
Package Size: 58×12.5×12.5mm
Material: Imported PI
