RF4 R1515 R2015 Desoldering Wick is a low-residue solder braid with 1.5mm/2.0mm width for phone motherboard PCB solder removal and BGA IC fast tin cleaning. Anti-oxidation, and micro-passivation. Efficiently removes solder without damaging components and pads, suitable for maintenance applications on mobile phone motherboards, BGA, QFP, and 0201 precision PCBs.
Option
1. RF4 R1515 desoldering wire: width 1.5 mm
2. RF4 R2015 desoldering wire: width 2.0 mm
Features:
1. High-purity pure copper braided material: Utilizing high-quality pure copper precision braiding, it offers fast thermal conductivity, reducing thermal damage to PCB pads and circuitry.
2. Fast and efficient solder absorption: Excellent capillary adsorption capacity quickly removes excess solder, improving rework efficiency.
3. Low-residue chemical treatment: Employing a high-quality, low-residue formula, it achieves clean solder absorption without the need for additional flux, reducing cleaning work.
4. Anti-oxidation and Corrosion Resistance: Exhibits excellent anti-oxidation and corrosion resistance, maintaining stable desoldering performance even after long-term storage.
5. Flexible and Easy to Handle: Soft and with good ductility, it easily accesses narrow solder joints, suitable for precision electronic repair.
6. Protects Precision Components: Effectively reduces the risk of damage to chips, pads, PCB traces, and other electronic components.
Product Parameters:
Brand: RF4
Product Name: Low-Residue Desoldering Wick
Model: R1515/R2015
Length: 1.5 m
Material: High-purity precision braided pure copper
Process: Low-residue chemical treatment
Features: Fast desoldering, low residue, anti-oxidation, corrosion resistance, flexible and easy to handle
Additional Flux Required: No additional flux required (can be used directly)
