RELIFE RL-044 Precision BGA Reballing Stencil CPU Chip Integrated Steel Mesh For iPhone 6-15 Pro Max, Huawei, Samsung Xiaomi and Android CPU series (SMC Qualcomm Snapdragon series, MTC Dimensity series, HIC hisilicon Kirin series, EMMC BGA series, ACU Android series). RELIFE RL-044 Integrated Tin Planting Steel Stencil For iPhone Huawei Samsung Xiaomi Android CPU RAM Power IC Chip Soldering Reballing Repair.
Option:
1. RELIFE RL-044 iPhone series BGA stencil: IPZ1-IPZ13 9pcs for iPhone 6-15 Pro Max A8-A17 CPU.
2. RELIFE RL-044 Huawei series BGA stencil: HW1-HW16 16pcs for Huawei.
3. RELIFE RL-044 Samsung series BGA stencil: SAM1-SAM15 15pcs for Samsung.
4. RELIFE RL-044 Xiaomi series BGA stencil: XM1-XM17 17pcs for Xiaomi.
5. RELIFE RL-044 Android CPU series BGA stencil: 4x ACU(ACU1-4), 6x EMMC(EMMC1-6), 9x HIC(HIC1-9), 6x MTC(MTC1-6), 10x SMC(SMC1-10), total 35pcs.
Features:
1. Precise alignment.
2. Round and full, precision hold pitch design.
3. Ultra-thin and super tough.
4. High temperature and wear resistance.
5. High quality steel, fast and convenient to use.
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