TBK-2206 Intelligent Laser Desoldering Machine with Infrared Laser Thermal Imaging and HD Microscope functions for Mobile Phone repair, like phone motherboard soldering, CPU BGA Chip welding desoldering repair, etc. Precise temperature control and powerful thermal imaging detection capabilities enable rapid identification of short circuits and fault points on circuit boards. The built-in high-definition microscope and screen are suitable for precision soldering and fault detection of electronic components.
Feature:
1. Integrates a high-definition microscope, thermal imaging camera, adjustable laser heater, and built-in lighting, saving space and improving efficiency.
2. The laser provides constant temperature heating with an adjustable temperature range, avoiding the errors and safety hazards of traditional heating methods. The temperature adjustment range is 100°C to 450°C.
3. Heating range from 5mm to 30mm, adaptable to soldering needs of different sizes.
4. Automatically identifies short circuits and high-temperature fault points on the motherboard using thermal imaging technology, highlighting the fault area.
5. Laser heating is fast and precise, with no heat radiation, avoiding damage to other components on the circuit board.
6. All-aluminum alloy body design, equipped with multiple cooling fans for effective heat dissipation and extended service life.
7. Equipped with a 10-inch high-definition display screen, a simple and easy-to-use control interface, and a foot switch for hands-free operation.
8. The simple control interface makes repair operations more efficient and comfortable.
Product Parameters:
Model: TBK 2206
Voltage: 110V-220V
Power: 110W
Laser Power: 45W
Heating Range: 5-30mm
Temperature: 100-450℃
Resolution: 1920x1080
Screen Size: 10”
Net Weight: 8kg
Packaging Weight: 9.5kg
Platform Dimensions: 320x200mm
Product Dimensions: 320x280x350mm
Packaging Dimensions: 390x320x420mm
