Gold Plated Tin Dragging Needle Set: MECHANIC SW-5S, LANRUI M24, RELIFE TO6, JTX BT1 FPC Connector Reballing Tinning Needle delivers precision soldering for phone motherboard FPC connectors, battery sockets, and IC pads. The copper ball tip ensures even solder application on motherboard pads without scratching or damaging components. Anti-static. Perfect for phone repair, PCB rework, and BGA chip, FPC connector soldering and desoldering.
Options:
1. MECHANIC SW-5S BGA Solder Needle Tip with Anti-Static Handle.
2. LANRUI M24 Red Copper Tin-Dragging Needle Set.
3. RELIFE TO6 FPC Tin-Dragging Needle Set.
4. JTX BT1 Ball-Tip BGA Tin-Dragging Needle set.
Features
1. Copper ball tip design – Ensures even, uniform soldering on motherboard pads and FPC connectors without scratching delicate components.
2. Superior Thermal Materials: Red copper or gold-plated tips ensure rapid heat transfer and non-stick performance, maximizing efficiency in tin application and removal.
3. Carbon Fiber Handle: Lightweight, heat-resistant, and thermally insulated to prevent fatigue during prolonged use.
4. Multi-Specification Configuration: Typically includes 3–5 tips of various sizes to meet diverse repair needs.
5. Versatile Applications: Suitable for tin removal, soldering, and reballing operations on IC chips and precision electronic components.
