WL Universal BGA Reballing Stencil Positioning Mold for iPhone - CHINA PHONEFIX

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WL Universal BGA Reballing Stencil Positioning Mold for iPhone

Name: WL Universal BGA Reballing Stencil Positioning Mold for iPhone
Brand: PHONEFIX
SKU: VC729
Price: 6.99 USD
Availability: InStock

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PHONEFIXSKU: VC729

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WL High-Quality Universal Repair Holder for CPU NAND Baseband Tin Plate Steel Net BGA Reballing Stencil Positioning Mold with Fixed Plate.

Description:

WL BGA Reballing Stencil Positioning Mold for WL BGA Reballing Stencil
Universal Aluminum Mould Base for WL 0.1mm BGA Reballing Stencil
Magnetic cell phone BGA reballing stencil positioning mold for BGA Chip repair
Compatible with: iPhone 5 5C 5S 6 6S 6P 6SP 7 7P / A6 A7 A8 A9 A10

Package included:

1pc x Holder

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WL Universal BGA Reballing Stencil Positioning Mold for iPhone

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WL Universal BGA Reballing Stencil Positioning Mold for iPhone

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