XZZ Motherboard Layered Testing Fixture For iPhone X-17 Pro Max/16e logic board function detection. Xinzhizao motherboard test fixture for iPhone X 11 12 13 14 15 16 17 series. iPhone motherboard middle layer tester for testing the iPhone X-17 Pro Max motherboard functions before installation.
Features:
1. Import high-quality pure copper probes (0.5mm probes)
2. High Alignment accuracy
3. for iPhone X/11/12/13/14/15/16/17 series.
4. CNC Processing Technology
5. Spring button buckle designed, simple operation, fast rebound, timely feedback, easy press.
6. Suitable for iPhone X-17 Pro Max/16e.
7. Mini design, easy to carry.
8. Advanced inspection to avoid any damage because of repeated disassembly and installation
Option:
1. XZZ FIX-XSM motherboard test fixture for iPhone X/XS/XS MAX.
2. XZZ FIX-11PM motherboard test fixture for iPhone 11/11Pro/11 Pro Max.
3. XZZ FIX-12 motherboard layered test stand for iPhone 12/12 mini/12Pro/12 Pro Max.
4. XZZ FIX-13 motherboard layered test frame for iPhone 13/13 mini/13Pro/13 Pro Max.
5. XZZ 14 Series motherboard test racks for iPhone 14/14 Plus/14Pro/14 Pro Max.
6. XZZ 15 Series motherboard fixture: SIM Card version for iPhone 15/15 Plus/15 Pro/15 Pro Max.
7. XZZ 15 Series motherboard fixture: eSIM US version for iPhone 15/15 Plus/15 Pro/15 Pro Max.
8. XZZ 16 Series 4-in-1 motherboard test fixture for iPhone 16/16 Plus/16 Pro/16 Pro Max.
9. XZZ 16e motherboard test fixture for iPhone 16e.
10. XZZ 17 Series 4-in-1 motherboard test fixture for iPhone 17/17 Air/17 Pro/17 Pro Max.
Please note(XZZ 15 Series):
1. The SIM Card plug-in version has a hole for inserting the card, but the eSIM has no hole, so there is no need to insert the card and the mobile phone number can be written directly.
2. The United States uses the eSIM US version, and other countries use the SIM Card version. If you need to repair the iPhone(US version) later, you can just buy a separate US version of the pin board.
Operation:
1. Place the motherboard lower layer on the test fixture.
2. Place Place the test pin plate corresponding to the motherboard.
3. Place the motherboard lower layer on the test pin board.
4. Put every component together, then fasten the buckles on both sides and start to test it.
