XZZ CPU/GPU Solder Pad and Explosion-proof Gasket Kit is used to fix damaged or missing solder pads on computer CPUs, GPUs, motherboards and PCB components. Unlike traditional flying wire loops, XZZ pre-cut patches include spot welding pads and 0.2mm/0.25mm explosion-proof gaskets are simply torn off and applied to the damaged pad area, preventing short circuits and improving repair durability. Perfect for PC computer motherboard repair, BGA rework, and chip-level restoration.
Options:
Spot Welding Pads: 0.3mm
Explosion-Proof Gaskets: thickness: 0.2mm, 0.25mm.
Features:
1. CPU/GPU Dedicated: Designed specifically for chip solder pad repair.
2. Solder Pad Design: Used for resoldering and repairing detached or damaged solder pads.
3. Solder Burst Prevention Pads: Helps solve repair problems such as solder bursts and short circuits.
4. Phosphor Bronze Material: Good conductivity, fatigue resistance, and stable performance over long-term use.
5. Ready to Use: Industrial-grade copper foil design; simply peel and apply.
6. Dual Thickness Options: Available in 0.2mm and 0.25mm thicknesses to suit different solder pad needs.
7. Precise Fit: Matches CPU/GPU chip repair scenarios, facilitating operation.
8. Improved Repair Efficiency: Reduces complex jumper wire and traditional solder pad repair operations.
9. Application: CPU/GPU Chip repair, BGA rework, motherboard pad restoration.
