XZZ GL-01 360℃ Rotating Circular Glass Clamp and XZZ GL-02 Square High Temperature Resistant Glass Fixture for Mobile Phone Motherboards CPU Chips Soldering Repair. Equipped with V-shaped bevel and two-way screw adjustment, it can firmly clamp the mobile phone motherboard, CPU, and chips, which is very suitable for removing glue, cleaning and soldering to repair mobile phone chips, CPU and other IC components to prevent damage.
Option:
1. XZZ GL-01 Circular Glass Clamp.
2. XZZ GL-02 Square Glass Clamp.
XZZ GL-01 Glass Fixture Features:
1. Precise Clamping Design: The new V-shaped clamping structure precisely secures various mobile phone motherboards and chips, preventing them from shifting during repair.
2. High Transmission and Corrosion Resistance: The highly transparent tempered glass panel offers strong corrosion resistance and is easy to clean, allowing for long-term cleanliness.
3. High-Temperature Resistance: The panel and mounting bracket are heat-resistant up to 600°C and maintain deformation over time, making it suitable for repair work in high-temperature environments.
4. Strong Compatibility: The bidirectional movement design is compatible with chips, motherboards, CPUs, and other ICs of varying sizes and models, meeting a wide range of repair needs.
5. Secure Clamping: The tight and secure clamping structure ensures the motherboard and chip remain secure during operation, improving repair efficiency.
6. Compact and Portable: The compact size makes it suitable for a variety of repair scenarios and easy to carry and use.
XZZ GL-02 Glass Fixture Features:
1. High Transmittance and Corrosion Resistance: The highly transparent tempered glass panel offers excellent corrosion resistance, is easy to clean, and maintains the panel's long-lasting beauty.
2. High-Temperature Resistance: The panel and synthetic stone fixture can withstand temperatures up to 600°C and withstand prolonged high-temperature operation without deformation.
3. Precise Locking Design: The new V-shaped, beveled latch structure precisely secures various mobile phone motherboards and chips, preventing them from shifting during repairs.
4. Secure Clamping: The clamping mechanism is tight and stable, preventing the motherboard or chip from loosening during operation, improving accuracy and efficiency during repairs.
5. Strong Compatibility: The bidirectional movement design supports a wide range of motherboards, chips, CPUs, and other IC components, ensuring excellent compatibility.
6. Convenient Cleaning: The one-wipe-clean design makes the tempered glass panel resistant to stains and easy to maintain.
XZZ GL-01 Specifications:
Model: XZZ GL-01 Rotating Circular Clamp
Net Weight: 290g
Gross Weight: 420g
Clamping Stroke: 5-75mm
Dimensions: 142x110x21mm
Packaging Dimensions: 165x128x33mm
XZZ GL-02 Glass Clamp Specifications:
Product Name: XZZ GL-02 Square Tempered Heat Insulating Glass Fixture
Net Weight: 160g
Gross Weight: 250g
Clamping Stroke: 6-68mm
Dimensions: 145x60x15mm
Packaging Dimensions: 163x78x33mm
