XZZ SAM Series BGA reballing stencils are designed for Samsung S7-S26 Ultra Series, A series phone motherboard repair. XZZ SAM-A to SAM-Q comprehensive BGA stencils feature a 0.12mm thickness steel mesh, suitable for Samsung S series, Note, A, and J series CPU, RAM, DDR, and BGA chip soldering repair.
Model:
XZZ SAM Series (S25-S26U): for Samsung S25/S25Ultra/S26/S26Ultra V1.0: JU544, WEZ02, 0101, MT666DP, SC8583, PMH0110, MRX77775P, QPM8325/QPM7815A, WCN7881, BGA153, SDR875, WCN7851, 58093-11, CPS4038, PE442, TRFK2701, PM8550VE, 8550VS.
XZZ SAM Series (S23-S24U): for Samsung S23/S23Ultra/S24/S24Ultra: 58080, WCN7851, SDR875, BGA153, 77042, 77048E, VC7643, QPM6810, QPW6815, PM8550BH, SDR753_EW, SDR735, WEZ02, CPS4038, 8550VS, QDM430, P94831UK, JE218, MAX77705C, RF322, PM8550VE.
SAM-A stencil: For Samsung S8/S8+/Note8 Series (G9500/G955U/N9500 etc.), 0.12mm Exynos8895/MSM8998 CPU BGA reballing stencil.
SAM-B stencil: For Samsung S7 Series (G9300/9350/9308/G930F etc.), 0.12mm Exynos8890/MSM8996 CPU BGA reballing stencil.
SAM-C stencil: For Samsung S6/S6+/Note5 Series (G9200/9250/N8200 etc.), 0.12mm Exynos7420 CPU BGA reballing stencil.
SAM-D stencil: For Samsung A520/A310/S5mini and universal A7/A5/A3/S5/J7 Series, 0.12mm Exynos3470/7580/7880 CPU BGA reballing stencil.
SAM-E stencil: For Samsung A9/C9 Series (A9000/A9100/C9000 etc.), 0.12mm MSM8976 CPU BGA reballing stencil.
SAM-F stencil: For Samsung C7010/J610-C7/J3/J5/A5 Series, 0.12mm MSM8916/MSM8953-B01 CPU BGA reballing stencil.
SAM-G stencil: For Samsung S9/S9+ Series, 0.12mm Qualcomm Snapdragon 845/Exynos9810 CPU BGA reballing stencil.
SAM-H stencil: For Samsung Note4 Series, 0.12mm Qualcomm APQ8084 CPU/BGA529 EMCP BGA reballing stencil.
SAM-I stencil: For Samsung J1/J2/J3/J4 Series (J100H/J2/J320F/G570M etc.), 0.12mm Exynos7570/3475, SC9830A/7730S CPU BGA reballing stencil.
SAM-J stencil: For Samsung S10/S10+/Note10 Series (G9730/G975/G977/N975 etc.), 0.12mm Exynos9820/Snapdragon 855-SM8150 CPU BGA reballing stencil.
SAM-K stencil: For Samsung J720/A305/G8870/G887/A40S/A8S Series, 0.12mm Snapdragon 710-SDM710/Exynos7904 CPU BGA reballing stencil.
SAM-L stencil: For Samsung S20 Series (G988U G988B/BR etc.), 0.12mm Snapdragon 865-SM8250/Exynos990 CPU BGA reballing stencil.
SAM-M stencil: For Samsung A60-A90 Series (A10S/A605F/A705F/A920F etc.), 0.12mm SDM450/SDM660/SM6150/MT6762 CPU BGA reballing stencil.
SAM-N stencil: For Samsung A10-A70 Series (A105F/A202F/A305N/A40S/A505F/A515F/A530F/A600F/A750F etc.), 0.12mm Exynos7870/7884/7885/7904/9610/9611 CPU BGA reballing stencil.
SAM-O stencil: For Samsung S21/21+/21 Ultra Series (G998U/G996U/Z Flip3/Z Fold3/W22 etc.), 0.12mm Snapdragon 888-SM8350/Exynos2100 CPU BGA reballing stencil.
SAM-P stencil: For Samsung A33/A53/A536/A13/A21s/F13/M33, 0.12mm Exynos1280-E8825/850-3830 CPU BGA reballing stencil.
SAM-Q stencil: For Samsung S22/S22+/S22Ultra/S901/S906/S908, 0.12mm Exynos2200/E9925/Snapdragon 8gen1-SM8450 CPU BGA reballing stencil.
