YCS Mobile Phone Repair Blades: YCS NO.11 Blade, YCS N01/N02 Prying Knife, YCS MY-CK01 CPU Degumming Knife, YCS Non-magnetic Tin Scraper. Precise, durable, high-quality, suitable for mobile phone/tablet motherboard CPU BGA chips prying removing, glue removal, engraving cutting, IC disassembly, solder paste/tin scraping and phone opening repair.
Option:
1. YCS NO. 11 Repair Blades (100pcs/set).
2. YCS MY-CK01 CPU Glue Removal Knife (10pcs/set).
3. YCS NO1 Glue Removal Blade (1pcs).
4. YCS NO2 CPU Removal Blade (1pcs).
5. YCS Non-Magnetic Scraper (1pcs).
Features:
1. High Strength and Toughness: Made of high-strength alloy, it resists wear and chipping, resulting in a long service life.
2. Long-Lasting Sharpness: The blade maintains its sharpness for a long time, ensuring fast and efficient glue removal with every use.
3. Versatile: Suitable for motherboard delamination, glue removal, and tapping, it is widely used in electronic component repair.
4. Precise Operation: The blade's refined design makes it suitable for precise operations, especially in confined spaces.
5. The YCS-NO1 Glue Removal Blade is designed to remove black adhesive without damaging the circuit board, easily scraping away stubborn glue.
6. The YCS-NO2 CPU Removal Blade is designed for removing CPUs, IC chips, and other electronic components, featuring a sharp, non-deformable blade.
7. YCS Non-Magnetic Stainless Steel Tin Scraper is made of high-quality non-magnetic stainless steel, offering comfort and control, allowing for precise operation without damaging delicate components.
