YCS DB02 Multi-Function Spudger Blade Set for mobile phone CPU Nand Flash Chips Removal and Glue Removal. YCS DB02 blade set includes a non-slip textured handle, sturdy blades, and a high-quality metal case for easy portability and storage, suitable for repairing mobile phones, electronic circuits, tablets, and other digital devices.
Features:
1. Non-slip textured handle: Provides a secure grip and ensures stable operation.
2. Strong blade: The blade is extremely strong and durable, suitable for a variety of repair environments.
3. Premium metal case: The high-quality metal case is durable and easy to carry.
4. 9-in-1 tool set: Includes three 9G handles and six different blades to meet various disassembly and repair needs.
5. Lightweight design: Reduces operator burden and improves repair efficiency.
6. Suitable for various repair scenarios: Especially suitable for removing glue and disassembling mobile phone motherboards, as well as repairing tablets, electronic circuits, and other devices.
Specifications:
Model: YCS DB02
Product Name: Multi-functional Knife
Dimensions: 140x8mm
Packaging Dimensions: 60x175x20
Applications: Repair of mobile phones, electronic circuits, tablets, and other digital devices.
Product List
Exquisite Iron Case x1
9G Handle x3
Blades x6
