YCS M.Y-XJ01 140°C 160°C 183°C 199°C Solder Paste for mobile phone PBC CPU IC and electronic components reballing repair. YCS M.Y solder paste uses advanced formulation technology to provide excellent soldering results, master Yang uses this solder paste to repair the IC during phone repair, ensuring bright and full solder joints with minimal residue. No cleaning is required after use. It is suitable for soldering and repairing motherboards in consumer electronic devices such as mobile phones, tablets, and laptops.
Feature:
1. Bright and Full Solder Joints: Smooth and even solder joints after soldering.
2. Minimal Residue: Low residue rate, reducing cleaning workload.
3. No Cleaning Required: No subsequent cleaning process is needed, avoiding the hassle of traditional post-soldering cleaning.
4. No Cold Solder Joints: Ensures high-quality soldering with strong and stable solder joints.
Product Parameters:
Name: M.Y Solder Paste
Model: M.Y-XJ01
Brand: Mr.Yang
Series: Macaron Series
Temperature Range: 140°C, 160°C, 183°C, 199°C
