YCS M.Y Comprehensive BGA Reballing Stencil for iPhone 16-17 Pro Max, M1/M2 IC, T2 IC, Drones UAV series and 360 Antigravity A1 repair. YCS Mr. Yang M.Y BGA IC soldering steel mesh for iPhone, DJI Drone, MacBook, Antigravity Drones repair, suitable for soldering and repairing various chips and BGA components.
Option:
1. YCS M.Y stencil for iPhone 16/16 Plus/16 Pro/16 Pro Max/16E.
2. YCS M.Y stencil for iPhone 17/17 Air/17 Pro/17 Pro Max.
3. YCS M.Y stencil for M1/M2 chips.
4. YCS M.Y stencil for T2 1st gen. and T2 2nd gen. chips.
5. YCS M.Y stencil for Drone UAV Air3/Mini3/3Pro/4Pro/5Pro chips.
6. YCS M.Y stencil for Antigravity A1 chips.
Features:
1. Multifunctional Platform: Suitable for DJI drones, iPhone, and other electronic devices, supporting soldering and chip repair.
2. Multiple Specifications: Offers various configurations, including integrated mesh and chip repair platforms suitable for different models.
3. High Efficiency and Stability: Ensures stability and efficiency during the repair process through precise design and high-strength materials.
4. High Versatility: Provides perfect support for both drone repair and chip soldering.
5. High Durability: Utilizes high-temperature resistant materials to ensure long-term efficient use.
