YCS M.Y BGA CPU IC Glue Removal Knife | Precise Solder Pad Cleaning Tool for iPhone & Android. YCS Mr. Yang M.Y Solder Pad Glue Removal Blade is used to remove adhesive from the solder pads of mobile phone CPU ICs, available in wide head and narrow head sizes, suitable for cleaning and removing adhesive from various motherboards CPU chip pads and mid-frames.
Option:
1. YCS M.Y glue removal knife (wide head 9mm) 10pcs/set.
1. YCS M.Y glue removal knife (narrow head 3mm) 10pcs/set.
Features:
1. Wide Applicability: Suitable for multiple surfaces such as pads, chips, and mid-frames, widely used in electronic product repair and manufacturing.
2. Two Blade Options: Wide head (9mm blade width) and narrow head (3mm blade width), choose according to different needs.
3. Highly Efficient Glue Removal: The specially designed blade makes the glue removal process more precise, suitable for microscopic operations.
4. Precise Operation: When used with a microscope, it enables high-precision and meticulous glue removal.
5. High-quality packaging: 10 pieces per box for easy storage and distribution.
Product Parameters:
Name: YCS M.Y Solder Pad Glue Removal Knife
Style: Wide Head/Narrow Head
Blade Width: 9mm/3mm
Packaging Type: Boxed
Quantity per Box: 10 pieces
Packaging Dimensions: 8.4x13x62mm
Packaging Weight: 7.7g/5.6g
