Mr. Yang M.Y iPhone 18 Pro/18 Pro Max Middle Layer Reballing Stencil Kit is designed for motherboard middle layer frame reballing on iPhone 18 Pro/18 Pro Max. This middle layer reballing platform kit includes 0.12mm BGA stencils, positioning plate and a magnetic base. Ideal for professional phone repair shops performing iPhone 18 series motherboard repair.
Features:
1. 0.12mm Stencil Thickness. Ultra-thin for accurate, uniform solder ball placement.
2. Universal Magnetic Base. Securely holds stencils and platforms in place during reballing.
3. iPhone motherboard middle frame reballing. Dedicated platforms for iPhone 18 Pro/18 Pro Max PCB mid-frame, stable, precise positioning.
Option:
1. M.Y iPhone 18 Pro series middle layer reballing platform set (1x base, 1x plate, 1x stencils).
2. M.Y iPhone 18 Pro/18 Pro Max mid-frame stencil.
3. M.Y iPhone 18 Pro/18 Pro Max mid-frame positioning plate.
