YCS Chip Repair Soldering Stencil is made of imported alloy steel, possessing superior flexibility and high-temperature resistance. It ensures precise mesh alignment and long-term durability, making it suitable for BGA soldering repair of mobile phone chips, especially for soldering CPUs and GPUs in Apple iPhone 6-17 Pro Max and Android Phone series.
Features:
1. High Precision: Each mesh is calibrated according to the original manufacturer's drawings, ensuring precise placement of each solder ball.
2. Superior Flexibility: Maintains the flexibility of the steel, resisting deformation under high temperatures and easily returning to its original shape.
3. High Temperature and Wear Resistance: Made of imported alloy steel, it can withstand temperatures up to 500℃ and is wear-resistant, allowing the stencil to maintain precision even after multiple uses.
4. Perfect Rounded Corner Design: The rounded corner design of the mesh ensures that each solder ball is uniform and full, meeting the soldering requirements of various chips.
5. Dynamic Updates: Continuously updated with new models to meet the latest chip soldering requirements of Apple and Android phones.
Product Parameters
Brand: YCS
Name: YCS Chip Repair Stencil
Type 1: Apple Mesh Series
Type 2: Android Mesh Series
Color: Natural Metal
Operating Temperature: -50℃~500℃
