YCS Master Young MY-608 IC-Baby spring self-locking chip clamp with heat-resistant base plate and anti-slip foot pads. Designed for precision IC repair, reballing, and chip-level maintenance. Stable clamping and precise positioning for Phone CPU and BGA IC repair. Three colors available.
Features:
1. Spring self-locking structure locks with one press for easy chip clamping and convenient operation.
2. Precise positioning design ensures accurate chip alignment and improves repair precision.
3. Stable clamping keeps the chip from sliding, ensuring stability during soldering and tinning.
4. Heat-resistant base plate withstands high-temperature operations for safe and reliable use.
5. Anti-slip foot pads on the bottom keep the clamp stable and prevent movement.
6. Available in black, red, and green to suit different preferences.
Product Parameters:
Brand: Master Young
Product Name: IC-Baby Spring Self-Locking Chip Clamp
Model: MY-608
Product Size: 54.5mm × 41.5mm × 18mm
Net Weight: 97g
Colors: Black/Red/Green
Structure: Spring Self-Locking
