YCS TH02 Spring Motherboard Repair Fixture utilizes a spring-loaded locking structure, high-temperature resistant synthetic stone clamping components, and an anti-slip metal base. It stably secures different types of mobile phone motherboards, reducing board displacement during repair and improving efficiency in adhesive removal, soldering, and chip repair. It is suitable for mobile phone motherboard and CPU chip soldering repair.
Features:
1. Spring-loaded locking: Quick clamping with a spring structure for easy operation.
2. Tight clamping: Stable motherboard fixation, reducing shaking during repair.
3. New adhesive removal slot: Assists in CPU/IC adhesive removal operations, improving repair efficiency.
4. High-temperature resistant material: Made of synthetic stone, high-temperature resistant and not easily deformed.
5. Anti-static and corrosion resistant: Suitable for precision electronic repair environments.
6. Anti-slip metal base: Equipped with silicone anti-slip strips, preventing displacement during repair.
Product parameters
Brand：YCS
Model：TH02
Product Name：Spring Repair Fixture
Weight: 310g
Fixture Size: 120x60mm
Package Size: 135x65x27mm
Material: High-Temperature Synthetic Stone + Metal Base
Application: Mobile Phone Motherboard/CPU/IC Repair
