Aixun Z14 4 In 1 Motherboard Middle Frame Planting Tin Stand/Platform For iPhone 14/14 Plus/14 Pro/14 Pro Max BGA Reablling Stencil Soldering Fixture.
Features:
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4-In-1: Supports iPhone 14 series, easily solves problems like uneven tin balls and bridging; solve with “One Board”, perfectly deal with mainboard middle frame tin planting of 14 full series.
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Accurate Mainboard Positioning: CNC high-precision integrated processing, stable position, planting tin without deviation.
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Fasten The Stencil With Strong Magnetism: ;Fit it closely to the mainboard, and narrow the gap between the stencil and the mainboard effectively.
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Base location columns: Built-in precise para-position, more convenient and fast
- Tin shields prevent SIM card holders from being tarnished by solder paste.
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Excellent steel material: ;Featured steel, even, and full tin balls, abrasion resistance, high toughness.
Steps:
- Fasten the reballing stencil on the middle frame, and stick the mainboard in the slot on the base.
- Fasten the middle frame on the base by aligning it with the location columns.
- Smear the low temp solder paste evenly on the reballing stencil, and remove the middle frame after that. (Do not blow the stencil with a hot air gun directly).
- Blow the solder paste with a hot air gun until it melts.
