Aixun Z14 4 In 1 Motherboard Middle Frame Planting Tin Stand/Platform For iPhone 14/14 Plus/14 Pro/14 Pro Max BGA Reablling Stencil Soldering Fixture.
Features:
4-In-1: Supports iPhone 14 series, easily solves problems like uneven tin balls and bridging; solve with “One Board”, perfectly deal with mainboard middle frame tin planting of 14 full series.
Accurate Mainboard Positioning: CNC high-precision integrated processing, stable position, planting tin without deviation.
Fasten The Stencil With Strong Magnetism: ;Fit it closely to the mainboard, and narrow the gap between the stencil and the mainboard effectively.
Base location columns: Built-in precise para-position, more convenient and fast
Tin shields prevent SIM card holders from being tarnished by solder paste.
Excellent steel material: ;Featured steel, even, and full tin balls, abrasion resistance, high toughness.
Steps:
Fasten the reballing stencil on the middle frame, and stick the mainboard in the slot on the base.
Fasten the middle frame on the base by aligning it with the location columns.
Smear the low temp solder paste evenly on the reballing stencil, and remove the middle frame after that. (Do not blow the stencil with a hot air gun directly).
Blow the solder paste with a hot air gun until it melts.
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